National Aeronautics and Space Administration March 12, 2012 – Federal Register Recent Federal Regulation Documents

This notice is issued in accordance with 35 U.S.C. 209(e) and 37 CFR 404.7(a)(1)(i). NASA hereby gives notice of its intent to grant an exclusive license in the United States to practice the invention described and claimed in Patent No. US 6,706,549, Multi-Functional Micro Electromechanical Devices and Method of Bulk Manufacturing Same, LEW 17,170-1; and Patent No. US 6,845,664, MEMS Direct Chip Attach Packaging Methodologies and Apparatuses for Harsh Environments, LEW 17,256-1, to Spectre Corporation, having its principal place of business in Elyria, Ohio. The fields of use may be limited to mining; farming; undersea exploration; seismic and environmental monitoring; heating, ventilating, and air-conditioning; chemical and petrochemical process control and process automation; water and waste-water processing; power transmission and power distribution; calibration and test equipment; semiconductor manufacturing; material manufacturing such as metallurgy, refractory processes, and steel, aluminum, copper, polymers, composites, and glass and ceramic production and processing; pharmaceutical production; and food and beverage production. The patent rights in these inventions as applicable have been assigned to the United States of America as represented by the Administrator of the National Aeronautics and Space Administration. The prospective exclusive license will comply with the terms and conditions of 35 U.S.C. 209 and 37 CFR 404.7.