National Aeronautics and Space Administration April 26, 2007 – Federal Register Recent Federal Regulation Documents

This notice is issued in accordance with 35 U.S.C. 209(c)(1) and 37 CFR 404.7(a)(1)(i). NASA hereby gives notice of its intent to grant an exclusive license in the United States to practice the invention described and claimed in U.S. Patent No. 6,706,549, Multi- Functional Micro Electromechanical Devices and Method of Bulk Manufacturing Same, U.S. Patent No. 6,769,303, Multi-Functional Micro Electromechanical Silicon Carbide Accelerometer, U.S. Patent No. 6,845,664, MEMS Direct Chip Attach Packaging Methodologies and Apparatuses for Harsh Environments to Endevco having its principal place of business in San Juan Capistrano, California. The patent rights in these inventions have been assigned to the United States of America as represented by the Administrator of the National Aeronautics and Space Administration. The prospective exclusive license will comply with the terms and conditions of 35 U.S.C. 209 and 37 CFR 404.7.