Current through Register Vol. 48, No. 38, September 20, 2024
a)
Applicability. Except as provided in subsection (a)(3) or (a)(4), this Subpart
BH applies to discharges resulting from plants that perform on any basis
material any of the six metal finishing operations listed in subsection (a)(1).
If any of those six operations are present, then this Subpart BH applies also
to discharges from the forty process operations specified in subsection (a)(2).
1) Six metal finishing operations.
Electroplating, electroless plating, anodizing, coating (chromating,
phosphating, and coloring), chemical etching and milling, and printed circuit
board manufacture.
2) Forty
additional process operations. Cleaning, machining, grinding, polishing,
tumbling, burnishing, impact deformation, pressure deformation, shearing, heat
treating, thermal cutting, welding, brazing, soldering, flame spraying,
sandblasting, other abrasive jet machining, electric discharge machining,
electrochemical machining, electron beam machining, laser beam machining,
plasma arc machining, ultrasonic machining, sintering, laminating, hot-dip
coating, sputtering, vapor plating, thermal infusion, salt bath descaling,
solvent degreasing, paint stripping, painting, electrostatic painting,
electropainting, vacuum metalizing, assembly, calibration, testing, and
mechanical plating.
3) Exclusions.
This Subpart BH does not apply if there are pretreatment standards that are
effective and applicable for the following industrial categories:
A) Nonferrous metal smelting and refining
(Subpart V);
B) Coil coating
(Subpart CN);
C) Porcelain
enameling (Subpart CO);
D) Battery
manufacturing (Subpart CJ);
E) Iron
and steel (Subpart U);
F) Metal
casting foundries (Subpart CM);
G)
Aluminum forming (Subpart CP);
H)
Copper forming (Subpart CQ);
I)
Plastic molding and forming (Subpart CL);
J) Nonferrous forming (Subpart CT);
and
K) Electrical and electronic
components (Subpart CR.
4) This Subpart BH does not apply to the
following:
A) Metallic platemaking and gravure
cylinder preparation conducted within or for printing and publishing
facilities; and
B) Existing
indirect discharging job shops and independent printed circuit board
manufacturers that are covered by Subpart N.
b) General Definitions. The Board
incorporates by reference 40
CFR 433.11 (2003). This incorporation
includes no later amendments or editions.
c) Monitoring Requirements. The Board
incorporates by reference 40
CFR 433.12 (2003). This incorporation
includes no later amendments or editions.
