International Trade Commission February 17, 2009 – Federal Register Recent Federal Regulation Documents
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In the Matter of Certain Semiconductor Chips With Minimized Chip Package Size and Products Containing Same; Notice of Commission Determination To Extend the Deadline for Receiving Written Submissions on Issues Relating to Violation of Section 337, Remedy, the Public Interest, and Bonding; Extension of the Target Date
Notice is hereby given that the U.S. International Trade Commission has determined to extend the deadline for written submissions on issues concerning violation of section 337, remedy, the public interest, and bonding and to extend the target date in the above captioned investigation to April 13, 2009.
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