Notification of Proposed Production Activity; Lam Research Corporation; Foreign-Trade Zone (FTZ) 18-San Jose, California; (Wafer Fabrication Equipment, Subassemblies, and Related Parts); Fremont, Livermore, Newark, Tracy and Hayward, California, 66522-66523 [2021-25458]

Download as PDF 66522 Federal Register / Vol. 86, No. 223 / Tuesday, November 23, 2021 / Notices terminal complex (769 acres), 2002 Maritime Blvd., Tampa; East Port terminal complex (61 acres), 3409 Causeway Blvd., Tampa; Pendola Point terminal complex (195 acres), 4808 Pendola Point Rd., Tampa; Port Redwing/South Bay terminal complex (344 acres), 6059 Diana Almeida Rd., Gibonston; Port Sutton terminal complex (21 acres), 3420 Port Sutton Rd., Tampa; and, Port Ybor terminal complex (54 acres), 801 South 20th Street, Tampa. The application indicates that the proposed expanded site is located within the Tampa U.S. Customs and Border Protection port of entry. In accordance with the FTZ Board’s regulations, Christopher Kemp of the FTZ Staff is designated examiner to evaluate and analyze the facts and information presented in the application and case record and to report findings and recommendations to the FTZ Board. Public comment is invited from interested parties. Submissions shall be addressed to the FTZ Board’s Executive Secretary and sent to: ftz@trade.gov. The closing period for their receipt is January 24, 2022. Rebuttal comments in response to material submitted during the foregoing period may be submitted during the subsequent 15-day period to February 7, 2022. A copy of the application will be available for public inspection in the ‘‘Online FTZ Information Section’’ section of the FTZ Board’s website, which is accessible via www.trade.gov/ ftz. Additional information regarding FTZ 79 is available via the FTZ Board’s website. For further information, contact Christopher Kemp at Christopher.Kemp@trade.gov. Dated: November 17, 2021. Camille R. Evans, Acting Executive Secretary. [FR Doc. 2021–25459 Filed 11–22–21; 8:45 am] BILLING CODE 3510–DS–P DEPARTMENT OF COMMERCE Foreign-Trade Zones Board lotter on DSK11XQN23PROD with NOTICES1 [B–77–2021] Notification of Proposed Production Activity; Lam Research Corporation; Foreign-Trade Zone (FTZ) 18—San Jose, California; (Wafer Fabrication Equipment, Subassemblies, and Related Parts); Fremont, Livermore, Newark, Tracy and Hayward, California Lam Research Corporation (Lam) submitted a notification of proposed production activity to the FTZ Board (the Board) for its facilities in Fremont, VerDate Sep<11>2014 18:09 Nov 22, 2021 Jkt 256001 Livermore, Newark, Tracy and Hayward, California within Subzone 18F. The notification conforming to the requirements of the Board’s regulations (15 CFR 400.22) was received on November 10, 2021. Pursuant to 15 CFR 400.14(b), FTZ production activity would be limited to the specific foreign-status material(s)/ component(s) and specific finished product(s) described in the submitted notification (summarized below) and subsequently authorized by the Board. The benefits that may stem from conducting production activity under FTZ procedures are explained in the background section of the Board’s website—accessible via www.trade.gov/ ftz. The proposed finished products and materials/components would be added to the production authority that the Board previously approved for the operation, as reflected on the Board’s website. The proposed finished products include: Chemical/mechanical planarization and other wafer surface modification equipment; various tools and process modules (for the chemical vapor or physical vapor deposition, or plasma dry etch, of materials on a wafer; for the plasma etch of the bevel edge of a wafer to remove yield-limiting residues and defects of a wafers surface; for the stripping of photoresist material on a wafer; for the ultraviolet thermal processing of a wafer surface; for wafer cleaning between chip-processing steps to remove yield-limiting residues and defects of a wafer surface) for semiconductor production; conductor material deposition process modules and machines for wafer packaging; transport modules; wafer transport robots; machines for the production of semiconductors, namely etch systems installation, maintenance, repair, retrofit, and upgrade kits; machines for manufacturing masks and assembling electronic circuits installation, maintenance, repair, retrofit, and upgrade kits; installation, maintenance, repair, retrofit, and upgrade kits (for semiconductor equipment and parts and assemblies of semiconductor equipment; chemical/mechanical planarization and other wafer surface modification equipment; transport modules; wafer transport robots); various tools and process modules (for the chemical vapor or physical vapor deposition, or plasma dry etch, of materials on a wafer; for the plasma etch of the bevel edge of a wafer to remove yield-limiting residues and defects of a wafer surface; for the stripping of photoresist material on a wafer; for the ultraviolet thermal processing of a wafer surface; for wafer cleaning between PO 00000 Frm 00008 Fmt 4703 Sfmt 4703 chip-processing steps to remove yieldlimiting residues and defects of a wafer surface) for semi-conductor production installation, maintenance, repair, retrofit, and upgrade kits; and, conductor material deposition process modules and machines for wafer packaging installation, maintenance, repair, retrofit, and upgrade kits (duty rate is duty-free). The proposed foreign-status materials and components include: Synthetic petroleum-based hydrocarbon greases and similar synthetic oils greases and similar synthetic oils; various sealants and adhesives (polymer-based sealants, glues, and pastes; polyvinyl chloride (PVC)-based sealants, glues, pastes, and cements; silicon-based sealants, glues, pastes, and cements; polyglycol dimethacrylate sealants, glues, pastes, and cements) used in the production and installation of semiconductor manufacturing equipment; thermal transfer print ribbon film; anti-static polyethylene bags used as packaging material; clear nylon heat sealed bags; various components used for clean room environments (disposable gloves made of nitrile synthetic rubber; tri-polymer blend non-disposable gloves; nontextile, non-silicon anti-static tissues and cleaning wipes with special surfactants); clear acetate face shields and protective caps; high-density polyethylene hard hats and protective caps; fused silica rods and pipes; linear acting engine and motor components (air cylinders; steel, aluminum, alumina ceramic, and/or plastic pins, pin lifters, and shims); polypropylene, polyetheretherketone steel, and/or polycarbonate valve covers; stainless steel, polyvinylidene difluoride (PVDF), and/or N-Formylmethionine valve adapters; polytetrafluoroethylene (PTFE), PVDF, polypropylene, PVC, plastic, and/or steel valve balls; aluminum, PVC, and/or steel valve panels and plates; aluminum, perfluoroelastomer polymer, and/or PTFE based TeflonTM composition valve doors; steel, aluminum, alumina ceramic, and/or plastic valve pins; fluorocarbon rubber, stainless steel, aluminum, morphous low modulus rubber, and/or perfluoroelastomer polymer bodies, gate, transport and loadlock valves, and valve parts specifically designed for semiconductor applications; weldments tubing of semiconductor manufacturing equipment tools; fluoroelastomer, aluminum, steel, plastic, and/or fluoropolymer elastomer and synthetic rubber compound rings, arms, cups, holders, plates, adapters, panels, pedestals, and other inner components E:\FR\FM\23NON1.SGM 23NON1 Federal Register / Vol. 86, No. 223 / Tuesday, November 23, 2021 / Notices designed specifically for semiconductor manufacturing equipment tools; semiconductor manufacturing equipment sub-assemblies; structural elements that may be composed of other metals, plastic or aluminum enclosures or assemblies with threaded inserts, screws, dowel pins, springs, and connectors for housings, enclosures, covers, and skins for semiconductor manufacturing equipment; air and exhaust ducts, end effectors, media dispensers designed specifically for semiconductor manufacturing equipment; alkaline batteries; rod-type sheathed cartridge heaters used to heat gases or liquids in distribution piping for semiconductor manufacturing equipment; tube holders and mountings of polyvinylidene fluoride, PVDF, other metals, or plastic materials; incandescent lamps and bulbs; solid state devices consisting of a lightemitting diode (LED) and photo diode; cables for voltage; and, focal lenses used for factory inspections (duty rate ranges from duty-free to 14%). The request indicates that certain materials/ components are subject to duties under Section 232 of the Trade Expansion Act of 1962 (Section 232) or Section 301 of the Trade Act of 1974 (Section 301), depending on the country of origin. The applicable Section 232 and Section 301 decisions require subject merchandise to be admitted to FTZs in privileged foreign status (19 CFR 146.41). Public comment is invited from interested parties. Submissions shall be addressed to the Board’s Executive Secretary and sent to: ftz@trade.gov. The closing period for their receipt is January 3, 2022. A copy of the notification will be available for public inspection in the ‘‘Online FTZ Information System’’ section of the Board’s website. For further information, contact Juanita Chen at juanita.chen@trade.gov. Dated: November 17, 2021. Camille R. Evans, Acting Executive Secretary. [FR Doc. 2021–25458 Filed 11–22–21; 8:45 am] lotter on DSK11XQN23PROD with NOTICES1 BILLING CODE 3510–DS–P VerDate Sep<11>2014 18:09 Nov 22, 2021 Jkt 256001 DEPARTMENT OF COMMERCE Bureau of Industry and Security Agency Information Collection Activities; Submission to the Office of Management and Budget (OMB) for Review and Approval; Comment Request; Procedures for Submitting Rebuttals and Surrebuttals Requests for Exclusions From and Objections to the Section 232 National Security Adjustments of Imports of Steel and Aluminum Bureau of Industry and Security, Commerce. ACTION: Notice of information collection, request for comment. AGENCY: The Department of Commerce, in accordance with the Paperwork Reduction Act of 1995 (PRA), invites the general public and other Federal agencies to comment on proposed, and continuing information collections, which helps us assess the impact of our information collection requirements and minimize the public’s reporting burden. The purpose of this notice is to allow for 60 days of public comment preceding submission of the collection to OMB. DATES: To ensure consideration, comments regarding this proposed information collection must be received on or before January 24, 2022. ADDRESSES: Interested persons are invited to submit comments by email to Mark Crace, IC Liaison, Bureau of Industry and Security, at mark.crace@ bis.doc.gov or to PRAcomments@ doc.gov). Please reference OMB Control Number 0694–0141 in the subject line of your comments. Do not submit Confidential Business Information or otherwise sensitive or protected information. FOR FURTHER INFORMATION CONTACT: Requests for additional information or specific questions related to collection activities should be directed to Mark Crace, IC Liaison, Bureau of Industry and Security, phone 202–482–8093 or by email at mark.crace@bis.doc.gov. SUPPLEMENTARY INFORMATION: SUMMARY: I. Abstract On March 8, 2018, the President issued Proclamations 9704 and 9705 concurring with the findings of the two reports and determining that adjusting imports through the imposition of duties on steel and aluminum is necessary so that imports of steel and aluminum will no longer threaten to impair the national security. The Proclamations also authorized the Secretary of Commerce, in consultation PO 00000 Frm 00009 Fmt 4703 Sfmt 4703 66523 with the Secretary of Defense, the Secretary of the Treasury, the Secretary of State, the United States Trade Representative, the Assistant to the President for Economic Policy, the Assistant to the President for National Security Affairs, and other senior executive branch officials as appropriate, to grant exclusions from the duties for domestic parties affected by the duties. This could take place if the Secretary determines the steel or aluminum for which the exclusion is requested is not produced in the United States in a sufficient and reasonably available amount or of a satisfactory quality or should be excluded based upon specific national security considerations. The President directed the Secretary to promulgate regulations as may be necessary to implement an exclusion process. The purpose of this information collection is to allow for submission of exclusions requests from the remedies instituted in presidential proclamations adjusting imports of steel into the United States and adjusting imports of aluminum into the United States. This collection of information gives U.S. Companies the opportunity to submit rebuttals to objections received on posted exclusion requests and also allows U.S. companies the opportunity to submit surrebuttals for objections they submitted that receive rebuttals under the Section 232 exclusion process. Adding a rebuttal and surrebuttal process is an important step in further improving the exclusion request and objection process for requesting exclusions from the remedies instituted by the President. These voluntary rebuttals and surrebuttals will allow the U.S. Government to better evaluate whether an exclusion request should be granted based on the information provided in an exclusion request and taking into account any objections to a submitted exclusion request, rebuttals, and surrebuttals. Many commenters on the March 19 rule, referenced above, requested the Department make this type of a change to ensure that the process was fair and the Department had all of the relevant information when an objection to an exclusion request received a rebuttal or a surrebuttal was received. II. Method of Collection Electronic. III. Data OMB Control Number: 0694–0141. Form Number(s): 0694–0141. Type of Review: Regular submission, extension of a current information collection. E:\FR\FM\23NON1.SGM 23NON1

Agencies

[Federal Register Volume 86, Number 223 (Tuesday, November 23, 2021)]
[Notices]
[Pages 66522-66523]
From the Federal Register Online via the Government Publishing Office [www.gpo.gov]
[FR Doc No: 2021-25458]


-----------------------------------------------------------------------

DEPARTMENT OF COMMERCE

Foreign-Trade Zones Board

[B-77-2021]


Notification of Proposed Production Activity; Lam Research 
Corporation; Foreign-Trade Zone (FTZ) 18--San Jose, California; (Wafer 
Fabrication Equipment, Subassemblies, and Related Parts); Fremont, 
Livermore, Newark, Tracy and Hayward, California

    Lam Research Corporation (Lam) submitted a notification of proposed 
production activity to the FTZ Board (the Board) for its facilities in 
Fremont, Livermore, Newark, Tracy and Hayward, California within 
Subzone 18F. The notification conforming to the requirements of the 
Board's regulations (15 CFR 400.22) was received on November 10, 2021.
    Pursuant to 15 CFR 400.14(b), FTZ production activity would be 
limited to the specific foreign-status material(s)/component(s) and 
specific finished product(s) described in the submitted notification 
(summarized below) and subsequently authorized by the Board. The 
benefits that may stem from conducting production activity under FTZ 
procedures are explained in the background section of the Board's 
website--accessible via www.trade.gov/ftz. The proposed finished 
products and materials/components would be added to the production 
authority that the Board previously approved for the operation, as 
reflected on the Board's website.
    The proposed finished products include: Chemical/mechanical 
planarization and other wafer surface modification equipment; various 
tools and process modules (for the chemical vapor or physical vapor 
deposition, or plasma dry etch, of materials on a wafer; for the plasma 
etch of the bevel edge of a wafer to remove yield-limiting residues and 
defects of a wafers surface; for the stripping of photoresist material 
on a wafer; for the ultraviolet thermal processing of a wafer surface; 
for wafer cleaning between chip-processing steps to remove yield-
limiting residues and defects of a wafer surface) for semi-conductor 
production; conductor material deposition process modules and machines 
for wafer packaging; transport modules; wafer transport robots; 
machines for the production of semiconductors, namely etch systems 
installation, maintenance, repair, retrofit, and upgrade kits; machines 
for manufacturing masks and assembling electronic circuits 
installation, maintenance, repair, retrofit, and upgrade kits; 
installation, maintenance, repair, retrofit, and upgrade kits (for 
semiconductor equipment and parts and assemblies of semiconductor 
equipment; chemical/mechanical planarization and other wafer surface 
modification equipment; transport modules; wafer transport robots); 
various tools and process modules (for the chemical vapor or physical 
vapor deposition, or plasma dry etch, of materials on a wafer; for the 
plasma etch of the bevel edge of a wafer to remove yield-limiting 
residues and defects of a wafer surface; for the stripping of 
photoresist material on a wafer; for the ultraviolet thermal processing 
of a wafer surface; for wafer cleaning between chip-processing steps to 
remove yield-limiting residues and defects of a wafer surface) for 
semi-conductor production installation, maintenance, repair, retrofit, 
and upgrade kits; and, conductor material deposition process modules 
and machines for wafer packaging installation, maintenance, repair, 
retrofit, and upgrade kits (duty rate is duty-free).
    The proposed foreign-status materials and components include: 
Synthetic petroleum-based hydrocarbon greases and similar synthetic 
oils greases and similar synthetic oils; various sealants and adhesives 
(polymer-based sealants, glues, and pastes; polyvinyl chloride (PVC)-
based sealants, glues, pastes, and cements; silicon-based sealants, 
glues, pastes, and cements; polyglycol dimethacrylate sealants, glues, 
pastes, and cements) used in the production and installation of 
semiconductor manufacturing equipment; thermal transfer print ribbon 
film; anti-static polyethylene bags used as packaging material; clear 
nylon heat sealed bags; various components used for clean room 
environments (disposable gloves made of nitrile synthetic rubber; tri-
polymer blend non-disposable gloves; non-textile, non-silicon anti-
static tissues and cleaning wipes with special surfactants); clear 
acetate face shields and protective caps; high-density polyethylene 
hard hats and protective caps; fused silica rods and pipes; linear 
acting engine and motor components (air cylinders; steel, aluminum, 
alumina ceramic, and/or plastic pins, pin lifters, and shims); 
polypropylene, polyetheretherketone steel, and/or polycarbonate valve 
covers; stainless steel, polyvinylidene difluoride (PVDF), and/or N-
Formylmethionine valve adapters; polytetrafluoroethylene (PTFE), PVDF, 
polypropylene, PVC, plastic, and/or steel valve balls; aluminum, PVC, 
and/or steel valve panels and plates; aluminum, perfluoroelastomer 
polymer, and/or PTFE based TeflonTM composition valve doors; 
steel, aluminum, alumina ceramic, and/or plastic valve pins; 
fluorocarbon rubber, stainless steel, aluminum, morphous low modulus 
rubber, and/or perfluoroelastomer polymer bodies, gate, transport and 
loadlock valves, and valve parts specifically designed for 
semiconductor applications; weldments tubing of semiconductor 
manufacturing equipment tools; fluoroelastomer, aluminum, steel, 
plastic, and/or fluoropolymer elastomer and synthetic rubber compound 
rings, arms, cups, holders, plates, adapters, panels, pedestals, and 
other inner components

[[Page 66523]]

designed specifically for semiconductor manufacturing equipment tools; 
semiconductor manufacturing equipment sub-assemblies; structural 
elements that may be composed of other metals, plastic or aluminum 
enclosures or assemblies with threaded inserts, screws, dowel pins, 
springs, and connectors for housings, enclosures, covers, and skins for 
semiconductor manufacturing equipment; air and exhaust ducts, end 
effectors, media dispensers designed specifically for semiconductor 
manufacturing equipment; alkaline batteries; rod-type sheathed 
cartridge heaters used to heat gases or liquids in distribution piping 
for semiconductor manufacturing equipment; tube holders and mountings 
of polyvinylidene fluoride, PVDF, other metals, or plastic materials; 
incandescent lamps and bulbs; solid state devices consisting of a 
light-emitting diode (LED) and photo diode; cables for voltage; and, 
focal lenses used for factory inspections (duty rate ranges from duty-
free to 14%). The request indicates that certain materials/components 
are subject to duties under Section 232 of the Trade Expansion Act of 
1962 (Section 232) or Section 301 of the Trade Act of 1974 (Section 
301), depending on the country of origin. The applicable Section 232 
and Section 301 decisions require subject merchandise to be admitted to 
FTZs in privileged foreign status (19 CFR 146.41).
    Public comment is invited from interested parties. Submissions 
shall be addressed to the Board's Executive Secretary and sent to: 
[email protected]. The closing period for their receipt is January 3, 2022.
    A copy of the notification will be available for public inspection 
in the ``Online FTZ Information System'' section of the Board's 
website.
    For further information, contact Juanita Chen at 
[email protected].

    Dated: November 17, 2021.
Camille R. Evans,
Acting Executive Secretary.
[FR Doc. 2021-25458 Filed 11-22-21; 8:45 am]
BILLING CODE 3510-DS-P
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