Foreign-Trade Zone (FTZ) 45-Portland, Oregon; Notification of Proposed Production Activity; Lam Research Corporation (Semiconductor Production Equipment, Subassemblies and Related Parts), Tualatin and Sherwood, Oregon, 22387-22389 [2021-08785]

Download as PDF Federal Register / Vol. 86, No. 80 / Wednesday, April 28, 2021 / Notices Agenda Wednesday, May 19, 2021 from 3:00 p.m. (ET) I. Welcome and Roll Call II. Announcements and Updates III. Approval of Minutes IV. Final Review and Vote on the Committee’s Draft Report V. Public Comment VI. Next Steps VII. Adjournment Dated: April 22, 2021. David Mussatt, Supervisory Chief, Regional Programs Unit. [FR Doc. 2021–08788 Filed 4–27–21; 8:45 am] BILLING CODE P DEPARTMENT OF COMMERCE Bureau of the Census Census Scientific Advisory Committee Bureau of the Census, Department of Commerce. ACTION: Notice of public virtual meeting. AGENCY: The Bureau of the Census (Census Bureau) is giving notice of a virtual meeting of the Census Scientific Advisory Committee (CSAC). The Committee will address ongoing outreach efforts needed to assist with the designing of a differential privacy suite for the 2020 Census data products that will meet programmatic, legal, and statistical requirements, including work on both the primary and secondary disclosure avoidance systems. Lastminute changes to the schedule are possible, which could prevent giving advance public notice of schedule adjustments. Please visit the Census Advisory Committees website at https:// www.census.gov/cac for the CSAC meeting information, including the agenda, and how to join the meeting. DATES: The virtual meeting will be held on: • Tuesday, May 25, 2021, from 11:00 a.m. to 2:30 p.m. EDT ADDRESSES: The meeting will be held via the WebEx platform at the following presentation link: https:// uscensus.webex.com/uscensus/onstage/ g.php?MTID=e351f8ffcb2e21b2437 a649a206a6d8d3. For audio, please call the following number: 1–888–469–2085. When prompted, please use the following Password: #Censusdata1 and Passcode: 2886934. jbell on DSKJLSW7X2PROD with NOTICES SUMMARY: FOR FURTHER INFORMATION CONTACT: Shana Banks, Advisory Committee Branch Chief, Office of Program, Performance and Stakeholder VerDate Sep<11>2014 19:17 Apr 27, 2021 Jkt 253001 Integration (PPSI), shana.j.banks@ census.gov, Department of Commerce, U.S. Census Bureau, telephone 301– 763–3815. For TTY callers, please use the Federal Relay Service at 1–800–877– 8339. SUPPLEMENTARY INFORMATION: The Committee provides scientific and technical expertise to address Census Bureau program needs and objectives. The members of the CSAC are appointed by the Director of the Census Bureau. The Committee has been established in accordance with the Federal Advisory Committee Act (Title 5, United States Code, Appendix 2, Section 10). All meetings are open to the public. A brief period will be set aside during the virtual meeting for public comments on May 25, 2021. However, individuals with extensive questions or statements must submit them in writing to shana.j.banks@census.gov, (subject line ‘‘CSAC Differential Privacy Virtual Meeting Public Comment’’). Ron S. Jarmin, Acting Director, Bureau of the Census, approved the publication of this Notice in the Federal Register. Dated: April 23, 2021. Sheleen Dumas, Department PRA Clearance Officer, Office of the Chief Information Officer, Commerce Department. [FR Doc. 2021–08841 Filed 4–27–21; 8:45 am] BILLING CODE 3510–07–P DEPARTMENT OF COMMERCE Foreign-Trade Zones Board [B–31–2021] Foreign-Trade Zone (FTZ) 45— Portland, Oregon; Notification of Proposed Production Activity; Lam Research Corporation (Semiconductor Production Equipment, Subassemblies and Related Parts), Tualatin and Sherwood, Oregon The Port of Portland, grantee of FTZ 45, submitted a notification of proposed production activity to the FTZ Board on behalf of Lam Research Corporation (Lam), located in Tualatin and Sherwood, Oregon. The notification conforming to the requirements of the regulations of the FTZ Board (15 CFR 400.22) was received on April 14, 2021. Lam already has authority to produce semiconductor production equipment, subassemblies and related parts within Subzone 45H. The current request would add finished products and foreign status materials/components to the scope of authority. Pursuant to 15 PO 00000 Frm 00004 Fmt 4703 Sfmt 4703 22387 CFR 400.14(b), additional FTZ authority would be limited to the specific foreignstatus materials/components and specific finished products described in the submitted notification (as described below) and subsequently authorized by the FTZ Board. Production under FTZ procedures could exempt Lam from customs duty payments on the foreign-status materials/components used in export production. On its domestic sales, for the foreign-status materials/components noted below and in the existing scope of authority, Lam would be able to choose the duty rates during customs entry procedures that apply to the finished products in its existing scope of authority and to the finished products listed below (duty free). Lam’s proposed finished products include tools and process modules for— and installation, maintenance, repair, retrofit, and upgrade kits for tools and process modules for—the following: Chemical vapor deposition, physical vapor deposition, and plasma dry etch of materials on a wafer for semiconductor production; plasma etch of the bevel edge of a wafer to remove yield-limiting residues and defects of a wafer surface for semi-conductor production; stripping of photoresist material on a wafer for semi-conductor production; ultraviolet thermal processing of a wafer surface for semiconductor production; and, wafer cleaning between chip-processing steps to remove yield-limiting residues and defects of a wafer surface for semiconductor production. Lam’s proposed finished products also include installation, maintenance, repair, retrofit, and upgrade kits for the following: Machines for the production of semiconductors, namely etch systems; machines for manufacturing masks and assembling electronic circuits; semiconductor equipment and parts and assemblies; chemical/ mechanical planarization and other wafer surface modification equipment; conductor material deposition process modules and machines for wafer packaging; transport modules; and, wafer transport robots. Finally, Lam’s proposed finished products include: Chemical/mechanical planarization and other wafer surface modification equipment; conductor material deposition process modules and machines for wafer packaging; transport modules; and, wafer transport robots. Lam would be able to avoid duty on foreign-status components which become scrap/waste. Customs duties also could possibly be deferred or reduced on foreign-status production equipment. E:\FR\FM\28APN1.SGM 28APN1 jbell on DSKJLSW7X2PROD with NOTICES 22388 Federal Register / Vol. 86, No. 80 / Wednesday, April 28, 2021 / Notices The materials/components sourced from abroad include: Diluted hydrogen gas used for calibration; freon gas; ammonia hydroxide solutions; potassium phosphate buffer solutions; sodium bicarbonate buffer solutions; hydrogen peroxide; polyvinyl chloride (PVC) cement; mineral oils used as machine lubricants; synthetic petroleum-based hydrocarbon greases and similar synthetic oils and greases; thermal joint compounds; scouring pastes and powders used for wafer polishing activities; polymer-based sealants, glues, and pastes used in the production and installation of semiconductor manufacturing equipment; PVC-based sealants, glues, pastes, and cements used in the production and installation of semiconductor manufacturing equipment; silicon-based sealants, glues, pastes, and cements used in the production and installation of semiconductor manufacturing equipment; polyglycol dimethacrylate sealants, glues, pastes, and cements used in the production and installation of semiconductor manufacturing equipment; thermal transfer print ribbon films; organic solvents for cleaning; sealants with activators; fluorine based coolants; epoxy resins; silicone cements and fillers; panels, plates, and simple structural components of plastics; cutting sheets of plastics; shims and simple spacers of plastics; foam block silicon adhesive; panels, plates, and simple structural components of rigid plastics; anti-static polyethylene bags used as packaging material; clear nylon heat sealed bags; plastic ductwork; heavy duty plastic gloves for acid protection; handles and levers of plastic used in semiconductor manufacturing equipment; hinges, mounts, latches, and brackets of plastic of a type for furniture; retaining rings of rubber; soft rubber tubing used in fluid/gas distribution; soft rubber tubing with fittings used in fluid/gas distribution; vulcanized rubber belts used in wafer and equipment movement; disposable gloves made of nitrile synthetic rubber used for clean room environments; tripolymer blend non-disposable gloves used for clean room environments; plastic tool containers; plastic case covers; silicone plastic tablet covers; non-textile, non-silicon antistatic tissues and cleaning wipes with special surfactants for use in clean room environments; paperboard and cardboard packaging materials; paperboard labels; schematics, diagrams, and similar technical drawings; right to use documentation; velcro tape, nylon line and nylon VerDate Sep<11>2014 19:17 Apr 27, 2021 Jkt 253001 support sling (parts of kits that are installed onto wafer fabrication equipment systems); clear acetate face shields and protective caps; highdensity polyethylene hard hats and protective caps; abrasive pads, disks and, strips for polishing semiconductor wafers; slurry troughs and similar ceramic dispensary articles; fused silica rods and pipes; safety glass windows; lamp bulbs; reflectors and collimators; fused silica and fused quartz components, disks, windows, liners, rings, tubes, holders, and funnels for laboratory semiconductor manufacturing equipment; beakers and similar lab equipment for holding/ conveying chemicals; viewports for laboratory semiconductor manufacturing equipment; fiberglass gaskets, spacers, and fasteners; fiberglass rings and washers for use in semiconductor manufacturing equipment process chambers; iron fittings for metal tubing used in fluid/ gas distribution equipment; stainless steel butt weld fittings; stainless steel canisters and chemical tanks used for maintaining chemicals for semiconductor manufacturing equipment of 304 or 316L; stainless steel rope winches; steel support cables and wires—braided, used as structural elements in semiconductor manufacturing equipment; steel guard chains, driver chains, roller chains and links used in mechanical equipment for wafer manufacturing equipment or installation equipment; steel roller chains and other belt chains used in mechanical equipment for wafer manufacturing equipment or installation equipment; steel tie down straps; steel pins used as fasteners for semiconductor manufacturing equipment; steel eyebolts; steel leaf springs; cast steel brackets for support of semiconductor manufacturing equipment components; copper conductor bars for transmission of radio frequency (RF) energy; copper tubing used in fluid distribution in semiconductor manufacturing equipment process; copper pipe fittings; aluminum top hat rails and related clips; bus bars, ground bars, and rods of aluminum; aluminum tape; aluminum labels; vacuum port screens of aluminum; tin anodes for electrolytic processing of metals on wafers; tin anodes and pellets for electrolytic processing of metals on wafers; jab saws; hammers; insertion or extractions tool sets; helicoil or pipe tapping tools; retractable knives used in installation/ maintenance of equipment; scissors used in installation/maintenance of equipment; metal latches with locks; hardware type brackets and mounts of PO 00000 Frm 00005 Fmt 4703 Sfmt 4703 metal; magnetically actuating cylinders; air cylinders for linear acting engines and motors; pins, pin lifters and, shims for linear acting engines and motors; hydraulic fluid power pumps; cryocompressors for fluid temperature control; condensers and compressors used in semiconductor manufacturing equipment; balancing scales; weight measurement equipment; weights for measurement equipment; fire suppression extinguishing systems; nozzles and orifices for fluid distribution system; hoists for wafer transport robots; scissor jacks; lift fixtures and lift fixtures parts for installation of semiconductor manufacturing equipment; calibration disks for semiconductor manufacturing equipment; barcode and thermal printers; slug buster punches; equipment chucks and fixtures for test and installation and related parts; electric drills, punches and, blades; helicoil repair kits; electric pipe and cable cutters; tablet docking stations; plates, pads, and lift fixtures, and related components of plastic, rubber, metal, thermoplastic polyetherimide (PEI) resins and polytetrafluoroethylene (PTFE) pins and materials; valve covers; valve adapters; valve ball; valve panels; valve doors; valve plates; valve pins; tapered roller bearings; needle roller bearings; cylindrical roller bearings; roller bearings, ball screws and, radial ball bearings; shafts, rollers, blocks and balls for bearings; chemical/mechanical planarization and other wafer surface modification equipment; gate, transport and loadlock valves that are specifically designed for semiconductor applications; machines for manufacturing masks and assembling electronic circuits; weldments tubing of semiconductor manufacturing equipment tools; rings, arms, cups, holders, plates, adapters, panels, pedestals and other inner components designed specifically for semiconductor manufacturing equipment tools; semiconductor manufacturing equipment sub-assemblies; structural elements of other metals, plastic or aluminum enclosures or assemblies with threaded inserts, screws, dowel pins, springs, and connectors for housing, enclosures, covers, and skins for semiconductor manufacturing equipment; bodies and parts of gate, transport and loadlock valves that are specifically designed for semiconductor applications; air and exhaust ducts, end effectors and media dispensers designed specifically for semiconductor manufacturing equipment; DC motors with output >750 W and ≤75 kW; AC motors with output >74.6 W and ≤746 E:\FR\FM\28APN1.SGM 28APN1 jbell on DSKJLSW7X2PROD with NOTICES Federal Register / Vol. 86, No. 80 / Wednesday, April 28, 2021 / Notices W; pistons, guards and similar motor components; electro-magnetic load coils and sensor magnets; alkaline batteries; lead storage batteries; nickel metal hybrid batteries; induction heaters for semiconductor manufacturing equipment; rod-type sheathed cartridge heaters used to heat gases or liquids in distribution piping for semiconductor manufacturing equipment; thermofoil used in heaters for semiconductor manufacturing equipment; input/output cards and panels for network equipment; load cell amplifiers, servo amplifiers and proximity amplifiers; digital video recorders; videos on DVD; flash memory cards; transponder readers; cathode-ray tube monitors for use with automatic data processing (ADP) machines; LCD color flat screen monitors for use with ADP machines; camera covers and holders of aluminum, stainless steel, other metals, and plastic materials; smoke detectors and sensors; sensors, lenses, frames and other parts of smoke detectors; aluminum electrolytic fixed capacitors; dielectric fixed capacitors; tube holders and mountings of polyvinylidene fluoride, polyvinylidene difluoride (PVDF), other metals, or plastic materials; connectors for optical cables; chassis, panels and boards for power distribution modules and similar controllers; supports, ferrules, fuse holders and similar parts of connectors; incandescent lamps and bulbs; discharge lamps other than UV lamps; light-emitting diode (LED) lamps used for illumination in semiconductor manufacturing equipment; electromagnetic interference (EMI) shield rings; semiconductor transistors used in electronic equipment; power block modules; semiconductor/crystal oscillators used in electronic equipment; solid state devices consisting of an LED and a photo diode; cables for voltage; graphite electrodes; insulators and insulator elements of quartz; focal lenses used for factory inspections; protective eyeglass frames; goggles and similar protective spectacles; compound optical microscopes; lasers for metrology and endpoint systems; optical light guide lenses; syringes; temperature monitors and hydrometers; thermocouple sensors or adapters; diaphragms, guards, adapters and gauges, vacuum filters and similar parts for flow and pressure meters; monochromators; digital counters; infrared sensors and radiation sensing equipment; multimeters; holding/moving carts for power distribution equipment; fluorescent lamps fixtures; and, pens and markers (duty rate ranges from duty-free to VerDate Sep<11>2014 19:17 Apr 27, 2021 Jkt 253001 20%). The request indicates that certain materials/components are subject to duties under Section 232 of the Trade Expansion Act of 1962 (Section 232) or Section 301 of the Trade Act of 1974 (Section 301), depending on the country of origin. The applicable Section 232 and Section 301 decisions require subject merchandise to be admitted to FTZs in privileged foreign status (19 CFR 146.41). Public comment is invited from interested parties. Submissions shall be addressed to the Board’s Executive Secretary and sent to: ftz@trade.gov. The closing period for their receipt is June 7, 2021. A copy of the notification will be available for public inspection in the ‘‘Reading Room’’ section of the Board’s website, which is accessible via www.trade.gov/ftz. For further information, contact Christopher Wedderburn at Chris.Wedderburn@trade.gov. Dated: April 22, 2021. Andrew McGilvray, Executive Secretary. [FR Doc. 2021–08785 Filed 4–27–21; 8:45 am] 22389 Yvette Springer at Yvette.Springer@ bis.doc.gov no later than May 5, 2021. To the extent time permits, members of the public may present oral statements to the Committee. The public may submit written statements at any time before or after the meeting. However, to facilitate distribution of public presentation materials to Committee members, the Committee suggests that presenters forward the public presentation materials prior to the meeting to Ms. Springer via email. The Assistant Secretary for Administration, with the concurrence of the delegate of the General Counsel, formally determined on February 9, 2021, pursuant to Section 10(d) of the Federal Advisory Committee Act, as amended (5 U.S.C. app. 2 § (10)(d)), that the portion of the meeting dealing with pre-decisional changes to the Commerce Control List and U.S. export control policies shall be exempt from the provisions relating to public meetings found in 5 U.S.C. app. 2 §§ 10(a)(1) and 10(a)(3). The remaining portions of the meeting will be open to the public. For more information, call Yvette Springer at (202) 482–2813. BILLING CODE 3510–DS–P Yvette Springer, Committee Liaison Officer. DEPARTMENT OF COMMERCE [FR Doc. 2021–08817 Filed 4–27–21; 8:45 am] BILLING CODE 3510–JT–P Bureau of Industry and Security Transportation and Related Equipment Technical Advisory Committee; Notice of Partially Closed Meeting DEPARTMENT OF COMMERCE The Transportation and Related Equipment Technical Advisory Committee will meet on May 12, 2021, at 11:30 a.m., Eastern Standard Time, via teleconference. The Committee advises the Office of the Assistant Secretary for Export Administration with respect to technical questions that affect the level of export controls applicable to transportation and related equipment or technology. Materials and Equipment Technical Advisory Committee; Notice of Partially Closed Meeting Agenda Public Session 1. Welcome and Introductions. 2. Status reports by working group chairs. 3. Public comments and Proposals. Closed Session 4. Discussion of matters determined to be exempt from the provisions relating to public meetings found in 5 U.S.C. app. 2 §§ 10(a)(1) and 10(a)(3). The open session will be accessible via teleconference to participants on a first come, first serve basis. To join the conference, submit inquiries to Ms. PO 00000 Frm 00006 Fmt 4703 Sfmt 4703 Bureau of Industry and Security The Materials and Equipment Technical Advisory Committee will meet on May 13, 2021, 10:00 a.m., Eastern Daylight Time, via teleconference. The Committee advises the Office of the Assistant Secretary for Export Administration with respect to technical questions that affect the level of export controls applicable to materials and related technology. Agenda Open Session 1. Opening Remarks and Introduction by BIS Senior Management. 2. Report from working groups. 3. Report by regime representatives. Closed Session 4. Discussion of matters determined to be exempt from the provisions relating to public meetings found in 5 U.S.C. app. 2 §§ 10(a)(1) and 10(a)(3). The open session will be accessible via teleconference on a first come, first E:\FR\FM\28APN1.SGM 28APN1

Agencies

[Federal Register Volume 86, Number 80 (Wednesday, April 28, 2021)]
[Notices]
[Pages 22387-22389]
From the Federal Register Online via the Government Publishing Office [www.gpo.gov]
[FR Doc No: 2021-08785]


-----------------------------------------------------------------------

DEPARTMENT OF COMMERCE

Foreign-Trade Zones Board

[B-31-2021]


Foreign-Trade Zone (FTZ) 45--Portland, Oregon; Notification of 
Proposed Production Activity; Lam Research Corporation (Semiconductor 
Production Equipment, Subassemblies and Related Parts), Tualatin and 
Sherwood, Oregon

    The Port of Portland, grantee of FTZ 45, submitted a notification 
of proposed production activity to the FTZ Board on behalf of Lam 
Research Corporation (Lam), located in Tualatin and Sherwood, Oregon. 
The notification conforming to the requirements of the regulations of 
the FTZ Board (15 CFR 400.22) was received on April 14, 2021.
    Lam already has authority to produce semiconductor production 
equipment, subassemblies and related parts within Subzone 45H. The 
current request would add finished products and foreign status 
materials/components to the scope of authority. Pursuant to 15 CFR 
400.14(b), additional FTZ authority would be limited to the specific 
foreign-status materials/components and specific finished products 
described in the submitted notification (as described below) and 
subsequently authorized by the FTZ Board.
    Production under FTZ procedures could exempt Lam from customs duty 
payments on the foreign-status materials/components used in export 
production. On its domestic sales, for the foreign-status materials/
components noted below and in the existing scope of authority, Lam 
would be able to choose the duty rates during customs entry procedures 
that apply to the finished products in its existing scope of authority 
and to the finished products listed below (duty free).
    Lam's proposed finished products include tools and process modules 
for--and installation, maintenance, repair, retrofit, and upgrade kits 
for tools and process modules for--the following: Chemical vapor 
deposition, physical vapor deposition, and plasma dry etch of materials 
on a wafer for semi-conductor production; plasma etch of the bevel edge 
of a wafer to remove yield-limiting residues and defects of a wafer 
surface for semi-conductor production; stripping of photoresist 
material on a wafer for semi-conductor production; ultraviolet thermal 
processing of a wafer surface for semi-conductor production; and, wafer 
cleaning between chip-processing steps to remove yield-limiting 
residues and defects of a wafer surface for semi-conductor production.
    Lam's proposed finished products also include installation, 
maintenance, repair, retrofit, and upgrade kits for the following: 
Machines for the production of semiconductors, namely etch systems; 
machines for manufacturing masks and assembling electronic circuits; 
semiconductor equipment and parts and assemblies; chemical/mechanical 
planarization and other wafer surface modification equipment; conductor 
material deposition process modules and machines for wafer packaging; 
transport modules; and, wafer transport robots.
    Finally, Lam's proposed finished products include: Chemical/
mechanical planarization and other wafer surface modification 
equipment; conductor material deposition process modules and machines 
for wafer packaging; transport modules; and, wafer transport robots. 
Lam would be able to avoid duty on foreign-status components which 
become scrap/waste. Customs duties also could possibly be deferred or 
reduced on foreign-status production equipment.

[[Page 22388]]

    The materials/components sourced from abroad include: Diluted 
hydrogen gas used for calibration; freon gas; ammonia hydroxide 
solutions; potassium phosphate buffer solutions; sodium bicarbonate 
buffer solutions; hydrogen peroxide; polyvinyl chloride (PVC) cement; 
mineral oils used as machine lubricants; synthetic petroleum-based 
hydrocarbon greases and similar synthetic oils and greases; thermal 
joint compounds; scouring pastes and powders used for wafer polishing 
activities; polymer-based sealants, glues, and pastes used in the 
production and installation of semiconductor manufacturing equipment; 
PVC-based sealants, glues, pastes, and cements used in the production 
and installation of semiconductor manufacturing equipment; silicon-
based sealants, glues, pastes, and cements used in the production and 
installation of semiconductor manufacturing equipment; polyglycol 
dimethacrylate sealants, glues, pastes, and cements used in the 
production and installation of semiconductor manufacturing equipment; 
thermal transfer print ribbon films; organic solvents for cleaning; 
sealants with activators; fluorine based coolants; epoxy resins; 
silicone cements and fillers; panels, plates, and simple structural 
components of plastics; cutting sheets of plastics; shims and simple 
spacers of plastics; foam block silicon adhesive; panels, plates, and 
simple structural components of rigid plastics; anti-static 
polyethylene bags used as packaging material; clear nylon heat sealed 
bags; plastic ductwork; heavy duty plastic gloves for acid protection; 
handles and levers of plastic used in semiconductor manufacturing 
equipment; hinges, mounts, latches, and brackets of plastic of a type 
for furniture; retaining rings of rubber; soft rubber tubing used in 
fluid/gas distribution; soft rubber tubing with fittings used in fluid/
gas distribution; vulcanized rubber belts used in wafer and equipment 
movement; disposable gloves made of nitrile synthetic rubber used for 
clean room environments; tri-polymer blend non-disposable gloves used 
for clean room environments; plastic tool containers; plastic case 
covers; silicone plastic tablet covers; non-textile, non-silicon 
antistatic tissues and cleaning wipes with special surfactants for use 
in clean room environments; paperboard and cardboard packaging 
materials; paperboard labels; schematics, diagrams, and similar 
technical drawings; right to use documentation; velcro tape, nylon line 
and nylon support sling (parts of kits that are installed onto wafer 
fabrication equipment systems); clear acetate face shields and 
protective caps; high-density polyethylene hard hats and protective 
caps; abrasive pads, disks and, strips for polishing semiconductor 
wafers; slurry troughs and similar ceramic dispensary articles; fused 
silica rods and pipes; safety glass windows; lamp bulbs; reflectors and 
collimators; fused silica and fused quartz components, disks, windows, 
liners, rings, tubes, holders, and funnels for laboratory semiconductor 
manufacturing equipment; beakers and similar lab equipment for holding/
conveying chemicals; viewports for laboratory semiconductor 
manufacturing equipment; fiberglass gaskets, spacers, and fasteners; 
fiberglass rings and washers for use in semiconductor manufacturing 
equipment process chambers; iron fittings for metal tubing used in 
fluid/gas distribution equipment; stainless steel butt weld fittings; 
stainless steel canisters and chemical tanks used for maintaining 
chemicals for semiconductor manufacturing equipment of 304 or 316L; 
stainless steel rope winches; steel support cables and wires--braided, 
used as structural elements in semiconductor manufacturing equipment; 
steel guard chains, driver chains, roller chains and links used in 
mechanical equipment for wafer manufacturing equipment or installation 
equipment; steel roller chains and other belt chains used in mechanical 
equipment for wafer manufacturing equipment or installation equipment; 
steel tie down straps; steel pins used as fasteners for semiconductor 
manufacturing equipment; steel eyebolts; steel leaf springs; cast steel 
brackets for support of semiconductor manufacturing equipment 
components; copper conductor bars for transmission of radio frequency 
(RF) energy; copper tubing used in fluid distribution in semiconductor 
manufacturing equipment process; copper pipe fittings; aluminum top hat 
rails and related clips; bus bars, ground bars, and rods of aluminum; 
aluminum tape; aluminum labels; vacuum port screens of aluminum; tin 
anodes for electrolytic processing of metals on wafers; tin anodes and 
pellets for electrolytic processing of metals on wafers; jab saws; 
hammers; insertion or extractions tool sets; helicoil or pipe tapping 
tools; retractable knives used in installation/maintenance of 
equipment; scissors used in installation/maintenance of equipment; 
metal latches with locks; hardware type brackets and mounts of metal; 
magnetically actuating cylinders; air cylinders for linear acting 
engines and motors; pins, pin lifters and, shims for linear acting 
engines and motors; hydraulic fluid power pumps; cryocompressors for 
fluid temperature control; condensers and compressors used in 
semiconductor manufacturing equipment; balancing scales; weight 
measurement equipment; weights for measurement equipment; fire 
suppression extinguishing systems; nozzles and orifices for fluid 
distribution system; hoists for wafer transport robots; scissor jacks; 
lift fixtures and lift fixtures parts for installation of semiconductor 
manufacturing equipment; calibration disks for semiconductor 
manufacturing equipment; barcode and thermal printers; slug buster 
punches; equipment chucks and fixtures for test and installation and 
related parts; electric drills, punches and, blades; helicoil repair 
kits; electric pipe and cable cutters; tablet docking stations; plates, 
pads, and lift fixtures, and related components of plastic, rubber, 
metal, thermoplastic polyetherimide (PEI) resins and 
polytetrafluoroethylene (PTFE) pins and materials; valve covers; valve 
adapters; valve ball; valve panels; valve doors; valve plates; valve 
pins; tapered roller bearings; needle roller bearings; cylindrical 
roller bearings; roller bearings, ball screws and, radial ball 
bearings; shafts, rollers, blocks and balls for bearings; chemical/
mechanical planarization and other wafer surface modification 
equipment; gate, transport and loadlock valves that are specifically 
designed for semiconductor applications; machines for manufacturing 
masks and assembling electronic circuits; weldments tubing of 
semiconductor manufacturing equipment tools; rings, arms, cups, 
holders, plates, adapters, panels, pedestals and other inner components 
designed specifically for semiconductor manufacturing equipment tools; 
semiconductor manufacturing equipment sub-assemblies; structural 
elements of other metals, plastic or aluminum enclosures or assemblies 
with threaded inserts, screws, dowel pins, springs, and connectors for 
housing, enclosures, covers, and skins for semiconductor manufacturing 
equipment; bodies and parts of gate, transport and loadlock valves that 
are specifically designed for semiconductor applications; air and 
exhaust ducts, end effectors and media dispensers designed specifically 
for semiconductor manufacturing equipment; DC motors with output >750 W 
and <=75 kW; AC motors with output >74.6 W and <=746

[[Page 22389]]

W; pistons, guards and similar motor components; electro-magnetic load 
coils and sensor magnets; alkaline batteries; lead storage batteries; 
nickel metal hybrid batteries; induction heaters for semiconductor 
manufacturing equipment; rod-type sheathed cartridge heaters used to 
heat gases or liquids in distribution piping for semiconductor 
manufacturing equipment; thermofoil used in heaters for semiconductor 
manufacturing equipment; input/output cards and panels for network 
equipment; load cell amplifiers, servo amplifiers and proximity 
amplifiers; digital video recorders; videos on DVD; flash memory cards; 
transponder readers; cathode-ray tube monitors for use with automatic 
data processing (ADP) machines; LCD color flat screen monitors for use 
with ADP machines; camera covers and holders of aluminum, stainless 
steel, other metals, and plastic materials; smoke detectors and 
sensors; sensors, lenses, frames and other parts of smoke detectors; 
aluminum electrolytic fixed capacitors; dielectric fixed capacitors; 
tube holders and mountings of polyvinylidene fluoride, polyvinylidene 
difluoride (PVDF), other metals, or plastic materials; connectors for 
optical cables; chassis, panels and boards for power distribution 
modules and similar controllers; supports, ferrules, fuse holders and 
similar parts of connectors; incandescent lamps and bulbs; discharge 
lamps other than UV lamps; light-emitting diode (LED) lamps used for 
illumination in semiconductor manufacturing equipment; electromagnetic 
interference (EMI) shield rings; semiconductor transistors used in 
electronic equipment; power block modules; semiconductor/crystal 
oscillators used in electronic equipment; solid state devices 
consisting of an LED and a photo diode; cables for voltage; graphite 
electrodes; insulators and insulator elements of quartz; focal lenses 
used for factory inspections; protective eyeglass frames; goggles and 
similar protective spectacles; compound optical microscopes; lasers for 
metrology and endpoint systems; optical light guide lenses; syringes; 
temperature monitors and hydrometers; thermocouple sensors or adapters; 
diaphragms, guards, adapters and gauges, vacuum filters and similar 
parts for flow and pressure meters; monochromators; digital counters; 
infrared sensors and radiation sensing equipment; multimeters; holding/
moving carts for power distribution equipment; fluorescent lamps 
fixtures; and, pens and markers (duty rate ranges from duty-free to 
20%). The request indicates that certain materials/components are 
subject to duties under Section 232 of the Trade Expansion Act of 1962 
(Section 232) or Section 301 of the Trade Act of 1974 (Section 301), 
depending on the country of origin. The applicable Section 232 and 
Section 301 decisions require subject merchandise to be admitted to 
FTZs in privileged foreign status (19 CFR 146.41).
    Public comment is invited from interested parties. Submissions 
shall be addressed to the Board's Executive Secretary and sent to: 
[email protected]. The closing period for their receipt is June 7, 2021.
    A copy of the notification will be available for public inspection 
in the ``Reading Room'' section of the Board's website, which is 
accessible via www.trade.gov/ftz.
    For further information, contact Christopher Wedderburn at 
[email protected].

    Dated: April 22, 2021.
Andrew McGilvray,
Executive Secretary.
[FR Doc. 2021-08785 Filed 4-27-21; 8:45 am]
BILLING CODE 3510-DS-P
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