, 44139-44140 [X16-80706]

Download as PDF Federal Register / Vol. 81, No. 129 / Wednesday, July 6, 2016 / Presidential Documents :Parts ... :] (8473 Parts ... :] [8473.10 Goods described in additional U.S. note 5 to this "8473.10.01 chapter.................................................................... :Free 44139 :45% Other: Parts: 8473.10.20 Of word processing machines: Printed circuit assemblies ............ :Free 8473.10.41 8473.10.60 8473.10.90 Other ............................................ :Free Other..................................................... :Free Other.............................................................. :Free :45% :45% :45% :45%" 13. Subheadings 8473.40.10 and 8473.40.85 are deleted and the following new provisions are inserted in lieu thereof: [8473 :Parts ... :] Parts ... :} [8473.40 Goods described in additional U.S. note 5 to this "8473.40.01 chapter: ................................................................... :Free 8473.40.10 8473.40.86 :35% Other: Printed circuit assemblies for automatic teller machines of subheading 8472.90.10.... :Free Other .............................................................. :Free :35% :35%" 14(a). Subheading 8479.89.98 is deleted and the following new provisions are inserted in lieu thereof: [8479 :Machines... :] [Other... :] [8479.89 Other:] "8479.89.92 Automated electronic component placement machines of a kind used solely or principally for the manufacture of printed circuit assemblies...................................... 8479.89.94 : Free Other............................................................. : 2.5% :35% : Free (A,AU,BH, : 35%" : C,CA,Cl,CO,E, : ll,JO,MA,MX, : OM,P,PA,PE, : SG) :1.2% {KR) (b) The duty rate in the "Rates of Duty !-Special" subcolumn followed by the symbol "(KR) 11 for subheading 8479.89.94 shall be deleted at the close of December 31 on each of the following VerDate Sep<11>2014 16:06 Jul 05, 2016 Jkt 238001 PO 00000 Frm 00013 Fmt 4705 Sfmt 4790 E:\FR\FM\06JYD0.SGM 06JYD0 ED06JY16.007</GPH> asabaliauskas on DSK3SPTVN1PROD with D0 7 44140 Federal Register / Vol. 81, No. 129 / Wednesday, July 6, 2016 / Presidential Documents years and the rate of duty set forth opposite each such year shall be inserted effective for goods of Korea in lieu thereof: 2017 2018 2019 2020 2021 1% 0.7% 0.5% 0.2% Free 15. The following new additional U.S. note 14 is inserted in numerical sequence in chapter 85: "14. For purposes of this chapter, the expression "goods described in additional U.S. note 14 to this chapter" are multi-component integrated circuits (MCOs}, comprising a combination of one or more monolithic, hybrid, and/or multi-chip integrated circuits with at least one of the following components: silicon-based sensors/ actuators, oscillators, resonators or combinations thereof1 or components performing the functions of articles classifiable under heading 8532, 8533, 8541, or inductors classifiable under heading 8504, formed to all intents and purposes indivisibly into a single body like an integrated circuit, as a component of a kind used for assembly onto a printed circuit board (PCB) or other carrier, through the connecting of pins, leads, balls, lands, bumps, or pads. For the purpose of this definition : 1. "Components" may be discrete, manufactured independently then assembled onto the rest of the MCO, or integrated into other components. 2. "Silicon based" means built on a silicon substrate, or made of silicon materials, or manufactured onto integrated circuit die. 3. {a) "Silicon based sensors" consist of microelectronic and/or mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of detecting physical or chemical quantities and transducing these into electric signals, caused by resulting variations in electric properties or displacement of a mechanical structure. "Physical or chemical quantities" relates to real world phenomena, such as pressure, acoustic waves, acceleration, vibration, movement, orientation, strain, magnetic field strength, electric field strength, light, radioactivity, humidity, flow, chemicals concentration, etc. (b) "Silicon based actuators" consist of microelectronic and mechanical structures that are created in the mass or on the surface of a semiconductor and that have the function of converting electrical signals into physical movement. (c) "Silicon based resonators" are components that consist of microelectronic and/or mechanical structures that are created in the mass or on the surface of a semiconductor and have the function of generating a mechanical or electrical oscillation of a predefined frequency that depends on the physical geometry of these structures in response to an external input. VerDate Sep<11>2014 16:06 Jul 05, 2016 Jkt 238001 PO 00000 Frm 00014 Fmt 4705 Sfmt 4790 E:\FR\FM\06JYD0.SGM 06JYD0 ED06JY16.008</GPH> asabaliauskas on DSK3SPTVN1PROD with D0 8

Agencies

Executive Office of the President

[Federal Register Volume 81, Number 129 (Wednesday, July 6, 2016)]
[Presidential Documents]
[Pages 44139-44140]
From the Federal Register Online via the Government Publishing Office [www.gpo.gov]
[FR Doc No: X16-80706]


[GRAPHIC] [TIFF OMITTED] TD06JY16.007


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