Mandatory Greenhouse Gas Reporting, 12934-12935 [2015-05549]
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12934
Federal Register / Vol. 80, No. 48 / Thursday, March 12, 2015 / Rules and Regulations
BNSF Swing Bridge, mile 105.6,
provides 39 feet of vertical clearance
above Columbia River Datum 0.0 while
in the closed position. Vessels able to
pass through the bridge in the closed
positions may do so at anytime. The
current operating schedule for the
bridge is set out in 33 CFR 117.5. The
normal operating schedule for the BNSF
Swing Bridge states that the bridge must
open promptly and fully on request.
This deviation allows the swing span of
the BNSF Railway Bridge across the
Columbia River, mile 105.6, to remain
in the closed-to-navigation position, and
need not open for maritime traffic from
5 p.m. on April 27, 2015 until 9 a.m. on
April 28, 2015. The bridge shall operate
in accordance to 33 CFR 117.5 at all
other times. Waterway usage on this
part of the Columbia River includes
vessels ranging from commercial tug
and tow vessels to recreational pleasure
craft including cabin cruisers and
sailing vessels. The bridge can be
opened for emergency vessels in
response to a call, however, if an
opening for emergencies is needed, an
extension of this deviation will be
required to complete the work. No
immediate alternate route for vessels to
pass is available on this part of the river.
The Coast Guard will also inform the
users of the waterways through our
Local and Broadcast Notices to Mariners
of the change in operating schedule for
the bridge so that vessels can arrange
their transits to minimize any impact
caused by the temporary deviation.
In accordance with 33 CFR 117.35(e),
the drawbridge must return to its regular
operating schedule immediately at the
end of the designated time period. This
deviation from the operating regulations
is authorized under 33 CFR 117.35.
Dated: March 5, 2015.
Steven M. Fischer,
Bridge Administrator, Thirteenth Coast Guard
District.
[FR Doc. 2015–05628 Filed 3–11–15; 8:45 am]
BILLING CODE 9110–04–P
ENVIRONMENTAL PROTECTION
AGENCY
40 CFR Part 98
Mandatory Greenhouse Gas Reporting
CFR Correction
In Title 40 of the Code of Federal
Regulations, Parts 96 to 99, revised as of
July 1, 2014, on pages 696 through 698,
in subpart I of part 98, tables I–5
through I–7 are corrected to read as
follows:
TABLE I–5 TO SUBPART I OF PART 98—DEFAULT EMISSION FACTORS (1–Uij) FOR GAS UTILIZATION RATES (Uij) AND BYPRODUCT FORMATION RATES (Bijk) FOR MEMS MANUFACTURING
Process gas i
Process type factors
CF4
Etch 1–Ui ...........................................................
Etch BCF4 .........................................................
Etch BC2F6 ........................................................
CVD Chamber Cleaning 1–Ui ...........................
CVD Chamber Cleaning BCF4 ..........................
CVD Chamber Cleaning BC3F8 ........................
0.7
NA
NA
0.9
NA
NA
C2F6
CHF3
CH2F2
10.4
10.4
10.06
10.4
10.07
10.08
NA
0.6
0.1
NA
NA
NA
NA
NA
NA
NA
NA
NA
NF3
Remote
c¥
C4F8
C3F8
NA
NA
NA
0.4
0.1
NA
10.2
NA
NA
NA
0.02
20.02
NA
0.2
0.2
0.1
0.1
NA
SF6
NF3
0.2
NA
NA
0.2
20.1
NA
C4F6a
0.2
NA
NA
NA
NA
NA
C5F8a
0.1
0.2
0.2
0.2
0.1
0.1
NA
10.3
10.2
NA
NA
NA
C4F8Oa
NA
NA
NA
0.1
0.1
0.4
Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is
not used in or emitted from a particular process sub-type or process type.
1 Estimate includes multi-gas etch processes.
2 Estimate reflects presence of low-k, carbide and multi-gas etch processes that may contain a C-containing fluorinated GHG additive.
TABLE I–6 TO SUBPART I OF PART 98—DEFAULT EMISSION FACTORS (1–Uij) FOR GAS UTILIZATION RATES (Uij) AND BYPRODUCT FORMATION RATES (Bijk) FOR LCD MANUFACTURING
Process gas i
Process type factors
C2F6
CF4
Etch 1–Ui ..........................................................................
Etch BCF4 ........................................................................
Etch BCHF3 ......................................................................
Etch BC2F4 .......................................................................
CVD Chamber Cleaning 1–Ui ..........................................
0.6
NA
NA
NA
NA
NA
NA
NA
NA
NA
CHF3
0.2
0.07
NA
0.05
NA
CH2F2
NA
NA
NA
NA
NA
c¥
C4F8
C3F8
NA
NA
NA
NA
NA
0.1
0.009
0.02
NA
NA
NF3
Remote
NA
NA
NA
NA
0.03
NF3
NA
NA
NA
NA
0.3
SF6
0.3
NA
NA
NA
0.9
Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply
that a particular gas is not used in or emitted from a particular process sub-type or process type.
TABLE I–7 TO SUBPART I OF PART 98—DEFAULT EMISSION FACTORS (1–Uij) FOR GAS UTILIZATION RATES (Uij) AND BYPRODUCT FORMATION RATES (Bijk) FOR PV MANUFACTURING
rljohnson on DSK3VPTVN1PROD with RULES
Process gas i
Process type factors
CF4
Etch 1–Ui ..........................................................................
Etch BCF4 ........................................................................
Etch BC2F6 .......................................................................
CVD Chamber Cleaning 1–Ui ..........................................
VerDate Sep<11>2014
14:12 Mar 11, 2015
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Frm 00020
C2F6
0.7
NA
NA
NA
Fmt 4700
CHF3
0.4
0.2
NA
0.6
Sfmt 4700
0.4
NA
NA
NA
CH2F2
NA
NA
NA
NA
C3F8
NA
NA
NA
0.1
E:\FR\FM\12MRR1.SGM
c¥
C4F8
0.2
0.1
0.1
0.1
12MRR1
NF3
Remote
NA
NA
NA
NA
NF3
NA
NA
NA
0.3
SF6
0.4
NA
NA
0.4
12935
Federal Register / Vol. 80, No. 48 / Thursday, March 12, 2015 / Rules and Regulations
TABLE I–7 TO SUBPART I OF PART 98—DEFAULT EMISSION FACTORS (1–Uij) FOR GAS UTILIZATION RATES (Uij) AND BYPRODUCT FORMATION RATES (Bijk) FOR PV MANUFACTURING—Continued
Process gas i
Process type factors
CF4
CVD Chamber Cleaning BCF4 .........................................
C2F6
NA
CHF3
0.2
CH2F2
NA
NA
C3F8
0.2
c¥
C4F8
0.1
NF3
Remote
NF3
NA
NA
SF6
NA
Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply
that a particular gas is not used in or emitted from a particular process sub-type or process type.
12163, Sept. 29, 1979, 44 FR 56673; and 3
CFR 1979 Comp., p. 435.
[FR Doc. 2015–05549 Filed 3–11–15; 8:45 am]
BILLING CODE 1505–01–D
Aman S. Djahanbani,
Chief Acquisition Officer.
[FR Doc. 2015–05580 Filed 3–11–15; 8:45 am]
AGENCY FOR INTERNATIONAL
DEVELOPMENT
BILLING CODE 6116–01–P
48 CFR Parts 709 and 752
NATIONAL AERONAUTICS AND
SPACE ADMINISTRATION
RIN 0412–AA76
Incorporate Various Administrative
Changes and Internal Policies in to the
USAID Acquisition Regulation (AIDAR)
U.S. Agency for International
Development.
ACTION: Direct final rule; Corrections.
AGENCY:
RIN 2700–AE01 and 2700–AE09
The U.S. Agency for
International Development (USAID) is
issuing corrections to FR Doc. 2014–
26051; Incorporate Various
Administrative Changes and Internal
Policies in to the USAID Acquisition
Regulation (AIDAR), that was published
on December 16, 2014 (79 FR 74985).
DATES: Effective March 16, 2015.
FOR FURTHER INFORMATION CONTACT:
Lyudmila Bond, Telephone: 202–567–
4753 or Email: lbond@usaid.gov.
SUPPLEMENTARY INFORMATION:
SUMMARY:
Corrections
In rule FR Doc. 2014–26051 published
in the Federal Register at 79 FR 74985,
December 16, 2015, make the following
corrections:
§ 709.403
[Corrected]
1. On page 74992, in the definitions of
‘‘Debarring official’’ and ‘‘Suspending
Official’’ in § 709.403, correct ‘‘Senior
Deputy Assistant Administrator, Bureau
for Management’’ to read ‘‘Assistant
Administrator, Bureau for Management,
or designee as delegated in Agency
policy found in ADS 103—Delegations
of Authority’’.
rljohnson on DSK3VPTVN1PROD with RULES
■
§ 752.7005
[Corrected]
On page 75002, § 752.7005(b)(1)(iv),
remove the second sentence.
Authority: Sec. 621, Pub. L. 87–195, 75
Stat. 445, (22 U.S.C. 2381) as amended; E.O.
VerDate Sep<11>2014
14:12 Mar 11, 2015
Jkt 235001
48 CFR Parts 1809, 1815, 1816, 1817,
1829, 1823, 1827, 1828, 1831, 1832,
1834, 1837, 1841, 1842, 1846, 1849,
1851, and 1852
NASA Federal Acquisition Regulation
Supplement
National Aeronautics and
Space Administration (NASA).
ACTION: Final rule.
AGENCY:
NASA is issuing a final rule
amending the NASA Federal
Acquisition Regulation Supplement
(NFS) with the goal of eliminating
unnecessary regulation, streamlining
overly-burdensome regulation,
clarifying language, and simplifying
processes where possible.
DATES: Effective April 13, 2015.
FOR FURTHER INFORMATION CONTACT:
Cynthia Boots, NASA, Office of
Procurement, email: cynthia.d.boots@
nasa.gov, or 202–358–1248.
SUPPLEMENTARY INFORMATION:
SUMMARY:
I. Background
The NASA FAR Supplement (NFS) is
codified at 48 CFR part 1800.
Periodically, NASA performs a
comprehensive review and analysis of
the regulation, makes updates and
corrections, and reissues the NASA FAR
Supplement. The last reissue was in
2004. The goal of the review and
analysis is to reduce regulatory burden
where justified and appropriate and
make the NFS content and processes
more efficient and effective, faster and
simpler, in support of NASA’s mission.
Consistent with Executive Order (E.O.)
13563, Improving Regulations and
PO 00000
Frm 00021
Fmt 4700
Sfmt 4700
Regulatory Review, NASA is currently
reviewing and revising the NFS with an
emphasis on streamlining it and
reducing associated burdens. Due to the
volume of the NFS, these revisions are
being made in increments.
NASA published two proposed rules
as the first two incremental steps to
update and revise the NASA FAR
Supplement: 78 FR 23199–23203, April
18, 2013, and 79 FR 57015–57032,
September 24, 2014. Together, these two
rules proposed regulatory changes to 19
Parts of the NFS. The two rules also
advised the public that no regulatory
changes were being made to an
additional 13 NFS Parts.
This final rule finalizes these two
proposed rules.
II. Discussion and Analysis
NASA reviewed the public comments
in the development of the final rule. A
discussion of the comments and the
changes made to the rule as a result of
those comments are provided as
follows:
A. Summary of Significant Changes
From the Proposed Rule
The definitions of ‘‘counterfeit goods’’
and ‘‘legally authorized source’’ at
1846.101 are deleted. NASA, in
conjunction with the FAR Council, is
working to develop and implement a
definition of counterfeit part in the
Federal Acquisition Regulation, which
would also address the concept of
‘‘legally authorized sources’’.
Consequently, the NFS will not have an
independent definition of either
‘‘counterfeit goods’’ or ‘‘legally
authorized source’’. Rather, use of the
term counterfeit part in the NFS will be
consistent with the FAR definition.
B. Analysis of Public Comments
Comment: In response to proposed
rule #1, NASA received comments from
three respondents. The three
respondents suggested that the proposed
definitions of ‘‘counterfeit goods’’ and
‘‘legally authorized source’’ were
problematic in that they introduce
inconsistencies with standard industry
E:\FR\FM\12MRR1.SGM
12MRR1
]]>Agencies
[Federal Register Volume 80, Number 48 (Thursday, March 12, 2015)]
[Rules and Regulations]
[Pages 12934-12935]
From the Federal Register Online via the Government Printing Office [www.gpo.gov]
[FR Doc No: 2015-05549]
=======================================================================
-----------------------------------------------------------------------
ENVIRONMENTAL PROTECTION AGENCY
40 CFR Part 98
Mandatory Greenhouse Gas Reporting
CFR Correction
In Title 40 of the Code of Federal Regulations, Parts 96 to 99,
revised as of July 1, 2014, on pages 696 through 698, in subpart I of
part 98, tables I-5 through I-7 are corrected to read as follows:
Table I-5 To Subpart I of Part 98--Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS
Manufacturing
--------------------------------------------------------------------------------------------------------------------------------------------------------
Process gas i
-----------------------------------------------------------------------------------------------------------
Process type factors NF3
CF4 C2F6 CHF3 CH2F2 C3F8 c- C4F8 Remote NF3 SF6 C4F6a C5F8a C4F8Oa
--------------------------------------------------------------------------------------------------------------------------------------------------------
Etch 1-Ui................................... 0.7 10.4 10.4 10.06 NA 10.2 NA 0.2 0.2 0.1 0.2 NA
Etch BCF4................................... NA 10.4 10.07 10.08 NA 0.2 NA NA NA 10.3 0.2 NA
Etch BC2F6.................................. NA NA NA NA NA 0.2 NA NA NA 10.2 0.2 NA
CVD Chamber Cleaning 1-Ui................... 0.9 0.6 NA NA 0.4 0.1 0.02 0.2 NA NA 0.1 0.1
CVD Chamber Cleaning BCF4................... NA 0.1 NA NA 0.1 0.1 20.02 20.1 NA NA 0.1 0.1
CVD Chamber Cleaning BC3F8.................. NA NA NA NA NA NA NA NA NA NA NA 0.4
--------------------------------------------------------------------------------------------------------------------------------------------------------
Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a
particular gas is not used in or emitted from a particular process sub-type or process type.
\1\ Estimate includes multi-gas etch processes.
\2\ Estimate reflects presence of low-k, carbide and multi-gas etch processes that may contain a C-containing fluorinated GHG additive.
Table I-6 To Subpart I of Part 98--Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-
Product Formation Rates (Bijk) for LCD Manufacturing
----------------------------------------------------------------------------------------------------------------
Process gas i
--------------------------------------------------------------------------------
Process type factors NF3
CF4 C2F6 CHF3 CH2F2 C3F8 c- C4F8 Remote NF3 SF6
----------------------------------------------------------------------------------------------------------------
Etch 1-Ui...................... 0.6 NA 0.2 NA NA 0.1 NA NA 0.3
Etch BCF4...................... NA NA 0.07 NA NA 0.009 NA NA NA
Etch BCHF3..................... NA NA NA NA NA 0.02 NA NA NA
Etch BC2F4..................... NA NA 0.05 NA NA NA NA NA NA
CVD Chamber Cleaning 1-Ui...... NA NA NA NA NA NA 0.03 0.3 0.9
----------------------------------------------------------------------------------------------------------------
Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas.
This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-
type or process type.
Table I-7 To Subpart I of Part 98--Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-
Product Formation Rates (Bijk) for PV Manufacturing
----------------------------------------------------------------------------------------------------------------
Process gas i
--------------------------------------------------------------------------------
Process type factors NF3
CF4 C2F6 CHF3 CH2F2 C3F8 c- C4F8 Remote NF3 SF6
----------------------------------------------------------------------------------------------------------------
Etch 1-Ui...................... 0.7 0.4 0.4 NA NA 0.2 NA NA 0.4
Etch BCF4...................... NA 0.2 NA NA NA 0.1 NA NA NA
Etch BC2F6..................... NA NA NA NA NA 0.1 NA NA NA
CVD Chamber Cleaning 1-Ui...... NA 0.6 NA NA 0.1 0.1 NA 0.3 0.4
[[Page 12935]]
CVD Chamber Cleaning BCF4...... NA 0.2 NA NA 0.2 0.1 NA NA NA
----------------------------------------------------------------------------------------------------------------
Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas.
This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-
type or process type.
[FR Doc. 2015-05549 Filed 3-11-15; 8:45 am]
BILLING CODE 1505-01-D
