Mandatory Greenhouse Gas Reporting, 12934-12935 [2015-05549]

Download as PDF 12934 Federal Register / Vol. 80, No. 48 / Thursday, March 12, 2015 / Rules and Regulations BNSF Swing Bridge, mile 105.6, provides 39 feet of vertical clearance above Columbia River Datum 0.0 while in the closed position. Vessels able to pass through the bridge in the closed positions may do so at anytime. The current operating schedule for the bridge is set out in 33 CFR 117.5. The normal operating schedule for the BNSF Swing Bridge states that the bridge must open promptly and fully on request. This deviation allows the swing span of the BNSF Railway Bridge across the Columbia River, mile 105.6, to remain in the closed-to-navigation position, and need not open for maritime traffic from 5 p.m. on April 27, 2015 until 9 a.m. on April 28, 2015. The bridge shall operate in accordance to 33 CFR 117.5 at all other times. Waterway usage on this part of the Columbia River includes vessels ranging from commercial tug and tow vessels to recreational pleasure craft including cabin cruisers and sailing vessels. The bridge can be opened for emergency vessels in response to a call, however, if an opening for emergencies is needed, an extension of this deviation will be required to complete the work. No immediate alternate route for vessels to pass is available on this part of the river. The Coast Guard will also inform the users of the waterways through our Local and Broadcast Notices to Mariners of the change in operating schedule for the bridge so that vessels can arrange their transits to minimize any impact caused by the temporary deviation. In accordance with 33 CFR 117.35(e), the drawbridge must return to its regular operating schedule immediately at the end of the designated time period. This deviation from the operating regulations is authorized under 33 CFR 117.35. Dated: March 5, 2015. Steven M. Fischer, Bridge Administrator, Thirteenth Coast Guard District. [FR Doc. 2015–05628 Filed 3–11–15; 8:45 am] BILLING CODE 9110–04–P ENVIRONMENTAL PROTECTION AGENCY 40 CFR Part 98 Mandatory Greenhouse Gas Reporting CFR Correction In Title 40 of the Code of Federal Regulations, Parts 96 to 99, revised as of July 1, 2014, on pages 696 through 698, in subpart I of part 98, tables I–5 through I–7 are corrected to read as follows: TABLE I–5 TO SUBPART I OF PART 98—DEFAULT EMISSION FACTORS (1–Uij) FOR GAS UTILIZATION RATES (Uij) AND BYPRODUCT FORMATION RATES (Bijk) FOR MEMS MANUFACTURING Process gas i Process type factors CF4 Etch 1–Ui ........................................................... Etch BCF4 ......................................................... Etch BC2F6 ........................................................ CVD Chamber Cleaning 1–Ui ........................... CVD Chamber Cleaning BCF4 .......................... CVD Chamber Cleaning BC3F8 ........................ 0.7 NA NA 0.9 NA NA C2F6 CHF3 CH2F2 10.4 10.4 10.06 10.4 10.07 10.08 NA 0.6 0.1 NA NA NA NA NA NA NA NA NA NF3 Remote c¥ C4F8 C3F8 NA NA NA 0.4 0.1 NA 10.2 NA NA NA 0.02 20.02 NA 0.2 0.2 0.1 0.1 NA SF6 NF3 0.2 NA NA 0.2 20.1 NA C4F6a 0.2 NA NA NA NA NA C5F8a 0.1 0.2 0.2 0.2 0.1 0.1 NA 10.3 10.2 NA NA NA C4F8Oa NA NA NA 0.1 0.1 0.4 Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type. 1 Estimate includes multi-gas etch processes. 2 Estimate reflects presence of low-k, carbide and multi-gas etch processes that may contain a C-containing fluorinated GHG additive. TABLE I–6 TO SUBPART I OF PART 98—DEFAULT EMISSION FACTORS (1–Uij) FOR GAS UTILIZATION RATES (Uij) AND BYPRODUCT FORMATION RATES (Bijk) FOR LCD MANUFACTURING Process gas i Process type factors C2F6 CF4 Etch 1–Ui .......................................................................... Etch BCF4 ........................................................................ Etch BCHF3 ...................................................................... Etch BC2F4 ....................................................................... CVD Chamber Cleaning 1–Ui .......................................... 0.6 NA NA NA NA NA NA NA NA NA CHF3 0.2 0.07 NA 0.05 NA CH2F2 NA NA NA NA NA c¥ C4F8 C3F8 NA NA NA NA NA 0.1 0.009 0.02 NA NA NF3 Remote NA NA NA NA 0.03 NF3 NA NA NA NA 0.3 SF6 0.3 NA NA NA 0.9 Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type. TABLE I–7 TO SUBPART I OF PART 98—DEFAULT EMISSION FACTORS (1–Uij) FOR GAS UTILIZATION RATES (Uij) AND BYPRODUCT FORMATION RATES (Bijk) FOR PV MANUFACTURING rljohnson on DSK3VPTVN1PROD with RULES Process gas i Process type factors CF4 Etch 1–Ui .......................................................................... Etch BCF4 ........................................................................ Etch BC2F6 ....................................................................... CVD Chamber Cleaning 1–Ui .......................................... VerDate Sep<11>2014 14:12 Mar 11, 2015 Jkt 235001 PO 00000 Frm 00020 C2F6 0.7 NA NA NA Fmt 4700 CHF3 0.4 0.2 NA 0.6 Sfmt 4700 0.4 NA NA NA CH2F2 NA NA NA NA C3F8 NA NA NA 0.1 E:\FR\FM\12MRR1.SGM c¥ C4F8 0.2 0.1 0.1 0.1 12MRR1 NF3 Remote NA NA NA NA NF3 NA NA NA 0.3 SF6 0.4 NA NA 0.4 12935 Federal Register / Vol. 80, No. 48 / Thursday, March 12, 2015 / Rules and Regulations TABLE I–7 TO SUBPART I OF PART 98—DEFAULT EMISSION FACTORS (1–Uij) FOR GAS UTILIZATION RATES (Uij) AND BYPRODUCT FORMATION RATES (Bijk) FOR PV MANUFACTURING—Continued Process gas i Process type factors CF4 CVD Chamber Cleaning BCF4 ......................................... C2F6 NA CHF3 0.2 CH2F2 NA NA C3F8 0.2 c¥ C4F8 0.1 NF3 Remote NF3 NA NA SF6 NA Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type. 12163, Sept. 29, 1979, 44 FR 56673; and 3 CFR 1979 Comp., p. 435. [FR Doc. 2015–05549 Filed 3–11–15; 8:45 am] BILLING CODE 1505–01–D Aman S. Djahanbani, Chief Acquisition Officer. [FR Doc. 2015–05580 Filed 3–11–15; 8:45 am] AGENCY FOR INTERNATIONAL DEVELOPMENT BILLING CODE 6116–01–P 48 CFR Parts 709 and 752 NATIONAL AERONAUTICS AND SPACE ADMINISTRATION RIN 0412–AA76 Incorporate Various Administrative Changes and Internal Policies in to the USAID Acquisition Regulation (AIDAR) U.S. Agency for International Development. ACTION: Direct final rule; Corrections. AGENCY: RIN 2700–AE01 and 2700–AE09 The U.S. Agency for International Development (USAID) is issuing corrections to FR Doc. 2014– 26051; Incorporate Various Administrative Changes and Internal Policies in to the USAID Acquisition Regulation (AIDAR), that was published on December 16, 2014 (79 FR 74985). DATES: Effective March 16, 2015. FOR FURTHER INFORMATION CONTACT: Lyudmila Bond, Telephone: 202–567– 4753 or Email: lbond@usaid.gov. SUPPLEMENTARY INFORMATION: SUMMARY: Corrections In rule FR Doc. 2014–26051 published in the Federal Register at 79 FR 74985, December 16, 2015, make the following corrections: § 709.403 [Corrected] 1. On page 74992, in the definitions of ‘‘Debarring official’’ and ‘‘Suspending Official’’ in § 709.403, correct ‘‘Senior Deputy Assistant Administrator, Bureau for Management’’ to read ‘‘Assistant Administrator, Bureau for Management, or designee as delegated in Agency policy found in ADS 103—Delegations of Authority’’. rljohnson on DSK3VPTVN1PROD with RULES ■ § 752.7005 [Corrected] On page 75002, § 752.7005(b)(1)(iv), remove the second sentence. Authority: Sec. 621, Pub. L. 87–195, 75 Stat. 445, (22 U.S.C. 2381) as amended; E.O. VerDate Sep<11>2014 14:12 Mar 11, 2015 Jkt 235001 48 CFR Parts 1809, 1815, 1816, 1817, 1829, 1823, 1827, 1828, 1831, 1832, 1834, 1837, 1841, 1842, 1846, 1849, 1851, and 1852 NASA Federal Acquisition Regulation Supplement National Aeronautics and Space Administration (NASA). ACTION: Final rule. AGENCY: NASA is issuing a final rule amending the NASA Federal Acquisition Regulation Supplement (NFS) with the goal of eliminating unnecessary regulation, streamlining overly-burdensome regulation, clarifying language, and simplifying processes where possible. DATES: Effective April 13, 2015. FOR FURTHER INFORMATION CONTACT: Cynthia Boots, NASA, Office of Procurement, email: cynthia.d.boots@ nasa.gov, or 202–358–1248. SUPPLEMENTARY INFORMATION: SUMMARY: I. Background The NASA FAR Supplement (NFS) is codified at 48 CFR part 1800. Periodically, NASA performs a comprehensive review and analysis of the regulation, makes updates and corrections, and reissues the NASA FAR Supplement. The last reissue was in 2004. The goal of the review and analysis is to reduce regulatory burden where justified and appropriate and make the NFS content and processes more efficient and effective, faster and simpler, in support of NASA’s mission. Consistent with Executive Order (E.O.) 13563, Improving Regulations and PO 00000 Frm 00021 Fmt 4700 Sfmt 4700 Regulatory Review, NASA is currently reviewing and revising the NFS with an emphasis on streamlining it and reducing associated burdens. Due to the volume of the NFS, these revisions are being made in increments. NASA published two proposed rules as the first two incremental steps to update and revise the NASA FAR Supplement: 78 FR 23199–23203, April 18, 2013, and 79 FR 57015–57032, September 24, 2014. Together, these two rules proposed regulatory changes to 19 Parts of the NFS. The two rules also advised the public that no regulatory changes were being made to an additional 13 NFS Parts. This final rule finalizes these two proposed rules. II. Discussion and Analysis NASA reviewed the public comments in the development of the final rule. A discussion of the comments and the changes made to the rule as a result of those comments are provided as follows: A. Summary of Significant Changes From the Proposed Rule The definitions of ‘‘counterfeit goods’’ and ‘‘legally authorized source’’ at 1846.101 are deleted. NASA, in conjunction with the FAR Council, is working to develop and implement a definition of counterfeit part in the Federal Acquisition Regulation, which would also address the concept of ‘‘legally authorized sources’’. Consequently, the NFS will not have an independent definition of either ‘‘counterfeit goods’’ or ‘‘legally authorized source’’. Rather, use of the term counterfeit part in the NFS will be consistent with the FAR definition. B. Analysis of Public Comments Comment: In response to proposed rule #1, NASA received comments from three respondents. The three respondents suggested that the proposed definitions of ‘‘counterfeit goods’’ and ‘‘legally authorized source’’ were problematic in that they introduce inconsistencies with standard industry E:\FR\FM\12MRR1.SGM 12MRR1

Agencies

[Federal Register Volume 80, Number 48 (Thursday, March 12, 2015)]
[Rules and Regulations]
[Pages 12934-12935]
From the Federal Register Online via the Government Printing Office [www.gpo.gov]
[FR Doc No: 2015-05549]


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ENVIRONMENTAL PROTECTION AGENCY

40 CFR Part 98


Mandatory Greenhouse Gas Reporting

CFR Correction

    In Title 40 of the Code of Federal Regulations, Parts 96 to 99, 
revised as of July 1, 2014, on pages 696 through 698, in subpart I of 
part 98, tables I-5 through I-7 are corrected to read as follows:

   Table I-5 To Subpart I of Part 98--Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS
                                                                      Manufacturing
--------------------------------------------------------------------------------------------------------------------------------------------------------
                                                                                             Process gas i
                                             -----------------------------------------------------------------------------------------------------------
            Process type factors                                                                      NF3
                                                CF4      C2F6     CHF3    CH2F2     C3F8   c- C4F8   Remote    NF3      SF6     C4F6a    C5F8a    C4F8Oa
--------------------------------------------------------------------------------------------------------------------------------------------------------
Etch 1-Ui...................................      0.7     10.4     10.4    10.06       NA     10.2       NA      0.2      0.2      0.1      0.2       NA
Etch BCF4...................................       NA     10.4    10.07    10.08       NA      0.2       NA       NA       NA     10.3      0.2       NA
Etch BC2F6..................................       NA       NA       NA       NA       NA      0.2       NA       NA       NA     10.2      0.2       NA
CVD Chamber Cleaning 1-Ui...................      0.9      0.6       NA       NA      0.4      0.1     0.02      0.2       NA       NA      0.1      0.1
CVD Chamber Cleaning BCF4...................       NA      0.1       NA       NA      0.1      0.1    20.02     20.1       NA       NA      0.1      0.1
CVD Chamber Cleaning BC3F8..................       NA       NA       NA       NA       NA       NA       NA       NA       NA       NA       NA      0.4
--------------------------------------------------------------------------------------------------------------------------------------------------------
Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a
  particular gas is not used in or emitted from a particular process sub-type or process type.
\1\ Estimate includes multi-gas etch processes.
\2\ Estimate reflects presence of low-k, carbide and multi-gas etch processes that may contain a C-containing fluorinated GHG additive.


   Table I-6 To Subpart I of Part 98--Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-
                              Product Formation Rates (Bijk) for LCD Manufacturing
----------------------------------------------------------------------------------------------------------------
                                                                  Process gas i
                                --------------------------------------------------------------------------------
      Process type factors                                                               NF3
                                   CF4      C2F6     CHF3    CH2F2     C3F8   c- C4F8   Remote    NF3      SF6
----------------------------------------------------------------------------------------------------------------
Etch 1-Ui......................      0.6       NA      0.2       NA       NA      0.1       NA       NA      0.3
Etch BCF4......................       NA       NA     0.07       NA       NA    0.009       NA       NA       NA
Etch BCHF3.....................       NA       NA       NA       NA       NA     0.02       NA       NA       NA
Etch BC2F4.....................       NA       NA     0.05       NA       NA       NA       NA       NA       NA
CVD Chamber Cleaning 1-Ui......       NA       NA       NA       NA       NA       NA     0.03      0.3      0.9
----------------------------------------------------------------------------------------------------------------
Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas.
  This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-
  type or process type.


   Table I-7 To Subpart I of Part 98--Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-
                               Product Formation Rates (Bijk) for PV Manufacturing
----------------------------------------------------------------------------------------------------------------
                                                                  Process gas i
                                --------------------------------------------------------------------------------
      Process type factors                                                               NF3
                                   CF4      C2F6     CHF3    CH2F2     C3F8   c- C4F8   Remote    NF3      SF6
----------------------------------------------------------------------------------------------------------------
Etch 1-Ui......................      0.7      0.4      0.4       NA       NA      0.2       NA       NA      0.4
Etch BCF4......................       NA      0.2       NA       NA       NA      0.1       NA       NA       NA
Etch BC2F6.....................       NA       NA       NA       NA       NA      0.1       NA       NA       NA
CVD Chamber Cleaning 1-Ui......       NA      0.6       NA       NA      0.1      0.1       NA      0.3      0.4

[[Page 12935]]

 
CVD Chamber Cleaning BCF4......       NA      0.2       NA       NA      0.2      0.1       NA       NA       NA
----------------------------------------------------------------------------------------------------------------
Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas.
  This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-
  type or process type.


[FR Doc. 2015-05549 Filed 3-11-15; 8:45 am]
 BILLING CODE 1505-01-D
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